The high-level overseas talent of the Organization
Department of the Central Committee of the CPC, professor of Guangdong
University of Technology
Graduated from Tianjin University, Xiamen University,
and University of Essex
Has more than 20 years of experience in chip package
and package substrate/PCB
Took charge of more than 10 projects, including the
project of manufacturing technology and complete sets of technology for very
large-scale integrated circuits and the National High-tech R&D Program (863
Program)
Obtained an accumulative amount of more than 120
authorized invention patents, released more than 130 papers; won First Prize of
Science and Technology Progress Award of Guangdong Province, Second Prize of
Science and Technology Progress of Jiangsu Province, Excellent Prize of China
Patent Award and Lee Kuan Yew Top Research.
Stock Code688359
